Bitget App
Trade smarter
Buy cryptoMarketsTradeFuturesStocksEarnInstitutionAI & More
TSMC recently announced that its CoWoS advanced packaging technology has achieved breakthroughs in the AI chip sector, with production yields for some products now reaching 98% to 99%. According to He Jun, Vice President of TSMC Advanced Packaging Technology and Services, these impressive yield rates mainly apply to CoWoS-packaged AI products based on a 5.5x reticle size. Currently, 5.5x reticle size CoWoS has entered mass production, and it is expected that by 2029, CoWoS will be expanded to a

TSMC recently announced that its CoWoS advanced packaging technology has achieved breakthroughs in the AI chip sector, with production yields for some products now reaching 98% to 99%. According to He Jun, Vice President of TSMC Advanced Packaging Technology and Services, these impressive yield rates mainly apply to CoWoS-packaged AI products based on a 5.5x reticle size. Currently, 5.5x reticle size CoWoS has entered mass production, and it is expected that by 2029, CoWoS will be expanded to a

智通财经智通财经2026/08/13 01:06
Show original
TSMC recently announced that its CoWoS advanced packaging technology has achieved breakthroughs in the field of AI chips, with production yields for some products increasing to 98% to 99%. According to He Jun, Vice President of Advanced Packaging Technology and Services at TSMC, this excellent yield performance mainly applies to CoWoS-packaged AI products based on a 5.5x reticle size. Currently, the 5.5x reticle size CoWoS has entered mass production, and it is expected that by 2029, CoWoS will be expanded to a 14x reticle size.
0
0

Disclaimer: The content of this article solely reflects the author's opinion and does not represent the platform in any capacity. This article is not intended to serve as a reference for making investment decisions.

Understand the market, then trade.
Bitget offers one-stop trading for cryptocurrencies, stocks, and gold.
Trade now!