AMD will cooperate with Goke Micro to develop CPO solutions
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To fit more HBM into chips, Nvidia accelerates advancement of glass substrate technology
German equipment manufacturer SCHMID has disclosed that it is collaborating with core firms in the supply chains of Intel, Nvidia, and AMD to develop glass substrate production equipment. Glass substrates are expected to replace silicon interposers, enhancing packaging density and data transmission capacity, and allowing for the integration of more HBMs. However, obstacles remain in the TGV metallization process, end-customer certification has not yet been completed, and large-scale commercialization will still take time.
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